In 2024, the electronic components industry continues to bring good news of innovation, with many companies achieving important patent results, injecting new momentum into industry development.
On November 23, Jiangsu Baojun New Materials Technology Co., Ltd. obtained a patent named "A Glue Dilution Device for Electronic Component Manufacturing", with authorization announcement number CN118384737B. This patent will help improve the efficiency and accuracy of glue dilution in the electronic component manufacturing process, ensuring production quality.
Also on November 23, Xi'an Qidi Intelligent Control System Technology Co., Ltd. obtained a patent for "A Welding Device for Electronic Component Processing", with authorization announcement number CN118768844B. This patent can improve the efficiency and reliability of electronic component processing and welding, which is of great significance for optimizing production processes and reducing costs.
On November 29, Kunshan Hanpin Electronics Co., Ltd. obtained a patent for "Shielding and Heat Insulation Tape with Exhaust Function", with authorization announcement number CN222064418U. Through its unique structural design, this tape can effectively block heat conduction to surrounding electronic components, protect electronic components from high temperature effects, extend their service life, and provide strong support for the stability and reliability of electronic equipment.
On December 2, Hefei Shupei Information Technology Co., Ltd. obtained a patent for "An Industrial Internet Equipment Monitoring Device", with authorization announcement number CN222072292U. Through the cooperation of components such as baffles and cooling fans, this device can cool electronic components when the equipment is in use, ensuring they work within the normal temperature range, thereby improving the performance and lifespan of the equipment.
On the same day, Qingbang Electronic Components (Sihong) Co., Ltd. obtained a patent for "Inductor Structure for Rapid Application Changes", with authorization announcement number CN222071689U. This inductor structure can reduce the time and cost required for manufacturing and assembly, improve production efficiency, and enhance the company's competitiveness in the market.
Chengdu Zhongwei Daxin Technology Co., Ltd. also obtained a patent for "Packaging Structure and Molecular Clock" on December 2, with authorization announcement number CN222073144U. This packaging structure, based on integrated design, achieves miniaturization and portability of electronic component packaging while ensuring signal transmission efficiency, meeting the requirements of modern electronic equipment for miniaturization and high performance.
On December 3, Azisa Technology (Shenzhen) Co., Ltd. obtained a patent for "Preparation Method of Biomass-based OLED Electronic Component Packaging Adhesive", with authorization announcement number CN118256190B. This patent provides a new environmentally friendly and efficient method for the preparation of OLED electronic component packaging adhesive, helping to promote the sustainable development of the OLED industry.
The achievement of these patent results reflects the unremitting efforts and proactive spirit of China's electronic component enterprises in technological innovation. They will strongly promote the technological upgrading and industrial development of the electronic components industry, providing solid support for the high-quality development of China's electronic information industry.
